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Cooling for small devices
With a built-in bootstrap circuit
Parameter Value Part Number IKW75N60T / K75T60 Type N-Channel Trench IGBT V₂CE (Collector-Emitter Voltage) 600V I₂C (Continuous Collector Current) 75A @ 25°C V₂CE(sat) (typ) 1
BGA64 is a common NAND flash package found in feature phones
Pack includes branded Orange Propellers
MC TF350 Flux Paste for BGA RT809 Cooling for small devicesMC TF350 is a professional grade flux paste engineered for BGA (Ball Grid Array) soldering applications. Formulated with a balanced blend of activators and solvents, it delivers reliable wetting and excellent solder joint quality on fine pitch components. Ideal for electronics assembly, rework, and repair work where precision and consistency matter. The paste maintains optimal viscosity for controlled application and leaves minimal residue after
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